Area Array Packaging Handbook: Manufacturing and Assembly 1st Edition – PDF/EPUB Version Downloadable
Author(s): Ken Gilleo
Publisher: McGraw-Hill
ISBN: 9780071374934
Edition: 1st Edition
$49,99
Delivery: This can be downloaded Immediately after purchasing.
Version: Only PDF Version.
Compatible Devices: Can be read on any device (Kindle, NOOK, Android/IOS devices, Windows, MAC)
Quality: High Quality. No missing contents. Printable
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Important: No Access Code
Description
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)*Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
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